Articles | Volume 6, issue 2
https://doi.org/10.5194/jsss-6-331-2017
https://doi.org/10.5194/jsss-6-331-2017
Regular research article
 | 
15 Sep 2017
Regular research article |  | 15 Sep 2017

Measuring strain during a cylindrical grinding process using embedded sensors in a workpiece

Mridusmita Sarma, Florian Borchers, Gerrit Dumstorff, Carsten Heinzel, and Walter Lang

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Cited articles

Boedecker, A., Habben, C., Sackmann, A., Budorf, K., Giese, E., and Lang, W.: Manufacturing of a wear detecting sensor made of 17-4PH steel using standard wafer processing technology, Sensor. Actuat. A-Phys., 171, 34–37, 2011.
Brinksmeier, E., Klocke, F., Lucca, D. A., Sölter, J., and Meyer, D.: Process Signatures – A New Approach to Solve the Inverse Surface Integrity Problem in Machining Processes, Procedia CIRP, 13, 429–434, 2014.
Cheng, X., Datta, A., Choi, H., and Li, X.: Metal Embedded Microsensors for Manufacturing Applications, Proceedings of IEEE SENSORS Conference, Daegu, Korea, 22–25 October 2006, https://doi.org/10.1109/ICSENS.2007.355920, 2006.
Cheng, X. and Li, X.: Development of Metal Embedded Microsensors by Diffusion Bonding and Testing in Milling Process, J. Manuf. Sci. E.-T. ASME, 130, 061010, https://doi.org/10.1115/1.3006318, 2008.
Choi, H., Datta, A., Cheng, X., and Li, X.: Microfabrication and Characterization of Metal-Embedded Thin-Film Thermomechanical Microsensors for Applications in Hostile Manufacturing Environments, J. Microelectromech. S., 15, 322–329, 2006.
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Short summary
In this work, we measured strain during a cylindrical grinding process in real time and in situ during the process. For this, we integrated strain sensors in a standard workpiece using microfabrication technology and performed grinding experiments on the so-called sensorial workpiece to characterize the manufacturing process. The approach can be used for measuring strain and temperature in other manufacturing processes, to characterize them.