Figures of merit of thermoelectric and bolometric thermal radiation sensors

Dillner, U.; Kessler, E.; Meyer, H.-G.

doi:https://doi.org/10.5194/jsss-2-85-2013

Articles | Volume 2, issue 1

https://doi.org/10.5194/jsss-2-85-2013

© Author(s) 2013. This work is distributed under
the Creative Commons Attribution 3.0 License.

https://doi.org/10.5194/jsss-2-85-2013

© Author(s) 2013. This work is distributed under
the Creative Commons Attribution 3.0 License.

Articles | Volume 2, issue 1

Regular research article

|

21 Jun 2013

Regular research article |

| 21 Jun 2013

Figures of merit of thermoelectric and bolometric thermal radiation sensors

U. Dillner, E. Kessler, and H.-G. Meyer

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Cited articles

Budzier, H. and Gerlach, G.: Thermal infrared sensors, Wiley, Chichester, 2011.

Chen, C.-N.: Fully quantitative characterization of CMOS-MEMS polysilicon/titanium thermopile infrared sensors, Sensor. Actuat. B-Chem., 161, 892–900, 2012.

Dillner, U., Baier, V., Kessler, E., Müller, J., Berger, A., Behrendt, D., and Preller, H.-A.: A high sensitivity single-chip 4-element thermoelectric infrared sensor, in: Proceedings of the 8th International Conference for Infrared Sensors and Systems, Nuremberg, Germany, 25–27 May 2004, 149–153, 2004.

Dillner, U., Kessler, E., Baier, V., Berger, A., Eick, T., Behrendt, D., and Urban, H.: A 64-pixel linear thermopile array chip designed for vacuum environment, Proceedings of the 9th International Conference for Infrared Sensors and Systems, Nuremberg, Germany, 30 May–1 June 2006, 295–300, 2006.

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